摘要
Inthispaper,theout-of-planedeformationofsiliconsurfaceofDirectChipAttachment(DCA)assembly,underthermalloading,wasmeasuredinreal-timebyTwyman/Greeninterferometry.Thecontourmapsoftheout-of-planedisplacementfieldsofsiliconsurfaceunderthermalloadingandcyclingofvarioustemperaturewereobtained.Experimentalresultsshowthattherelationbetweentheout-of-planedisplacementandtemperatureisnonlinearandvarieswithtempera-turecycling,duetononlinearmechanicalbehaviorofthematerialsusedinelectronicpackaging.Acomparisonoftheout-of-planedisplacementfieldsofsiliconsurfacemeasuredbyT/Ginterferometryinreal-timeandreplicatingtechniqueofhightem-peraturespecimengratingofmoireinterferometrywasmade.
出版日期
1997年02月12日（中国期刊网平台首次上网日期，不代表论文的发表时间）
