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Electroless plating of copper layer on surfaces of urea-formaldehyde microcapsule particles containing paraffin for low infrared emissivity

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DOI odwv765yjk/1595456

作者 Xi Zhou;Jian Mao;Zhen Qiao

机构地区不详

出处《中国颗粒学报：英文版》 2016年1期

关键词颗粒学工业通用技术粉末技术产品设计

分类 [理学][力学]

出版日期 2016年01月11日（中国期刊网平台首次上网日期，不代表论文的发表时间）

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来源期刊

中国颗粒学报：英文版

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颗粒学工业通用技术粉末技术产品设计

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