摘要
Soldersizeeffectonearlystageinterfacialintermetalliccompound(IMC)evolutioninwettingreactionbetweenSne3.0Age0.5Cusolderballsandelectrolessnickelelectrolesspalladiumimmersiongold(ENEPIG)padsat250Cwasinvestigated.TheinterfacialIMCstransformedfrominitialneedle-androdtype(Cu,Ni)6Sn5tododecahedron-type(Cu,Ni)6Sn5andthentoneedle-type(Ni,Cu)3Sn4attheearlyinterfacialreactionstage.Moreover,theseIMCtransformationsoccurredearlierinthesmallersolderjoints,wherethedecreasingrateofCuconcentrationwasfasterduetotheCuconsumptionbytheformationofinterfacial(Cu,Ni)6Sn5.Onthermodynamics,thedecreaseofCuconcentrationinliquidsolderchangedthephaseequilibriumattheinterfaceandthusresultedintheevolutionofinterfacialIMCs;onkinetics,largersolderjointshadsufficientCufluxtowardtheinterfacetofeedthe(Cu,Ni)6Sn5growthincontrasttosmallersolderjoints,thusresultedinthedelayedIMCtransformationandtheformationoflargerdodecahedron-type(Cu,Ni)6Sn5grains.Insmallersolders,nospallingbuttheconsumptionof(Cu,Ni)6Sn5grainsbytheformationof(Ni,Cu)3Sn4grainsoccurredwheresmallerdiscrete(Cu,Ni)6Sn5grainsformedattheinterface.
出版日期
2015年03月13日（中国期刊网平台首次上网日期，不代表论文的发表时间）
