Fatiguecrackingtestsofasolderjointwerecarriedoutusingin-situscanningelectronmicroscopy(SEM)technologyundertensileandbendingcyclicloadings.Themethodforpredictingthefatiguelifeisprovidedbasedonthefatiguecrackgrowthrateofthesolderjoint.Theresultsshowthattheeffectoftheloadingtypeonthefatiguecrackgrowthbehaviorofasolderjointcannotbeignored.Inaddition,thefiniteelementanalysisresultshelpquantitativelyestimatetheresponserelationshipbetweensolderjointstructures.Thefatiguecrackinitiationlifeofasolderjointisingoodagreementwiththefatiguelife(N50%)ofatotallyelectronicboardwith36solderjoints.