TheCu/Sn-3.OAg-0.5Cu/Cubuttingsolderjointswerefabricatedtoinvestigatetheevolutionoftheinterfacialintermetalliccompound(IMC)andthedegradationofthetensilestrengthofsolderjointsundertheeffectofelectromigration(EM)andagingprocesses.Scanningelectronmicroscopy(SEM)resultsindicatedthattheCu_6Sn_5interfacialIMCpresentedobviousasymmetricalgrowthwiththeincreaseofEMtimeundercurrentdensityof1.78×10~4A/cm~2at100℃,andthegrowthofanodicIMCpresentedaparabolicrelationshipwithtimewhilethecathodicIMCgotthinnergradually.However,asforagingsamplesat100℃withoutcurrentstressing,theCu_6Sn_5IMCpresentedasymmetricalgrowthwithaslowerratethantheanodicIMCofEMsamples.Thetensileresultsindicatedthatthetensilestrengthofthesolderjointsundercurrentstressdeclinedmoredrasticwithtimethantheagingsamples,andthefracturemodetransformedfromductilefracturetobrittlefracturequicklywhilethefracturemodeofagingsamplestransformedfromcup-coneshapedfracturetomicroporousgatheringfractureinaslowway.
