简介:Inthispaper,thebrazingmechanismofLY12aluminumalloyatmiddlerangetemperaturewaspresented.TheCsF-AlF3non-corrosivefluxwasutilizedtoremovethecomplexoxidefilmonthesurfaceofLY12aluminumalloy.TheresultsrevealedthattheoxidefilmwasremovedbytheimprovedCsF-AlF3fluxaccompaniedwiththeoccurrenceofreactionaswellasdissolutionandthecompoundsCsFplayedanimportantroletoremovetheoxidefilm.Actually,thehighactivityofflux,say,theabilitytoremovetheoxidefilm,wasduetothepresenceofthecompounds,suchasNH4F,NH4AlF4andcompositemoltensalt.TheproductionofHFwasthekeyissuetoacceleratethereactionandenhancetoeliminatetheoxidefilmbydissolution.ItwasfoundthattherareearthelementLaatsmallpercentagewasnotenrichedattheinterface.Moreover,therareearthfluorideenhancedthedissolutionbehavior.
简介:本文中介绍了物联网的特点及其相关电子产品对PCB基板材料的要求、目前市场上可供选用基板材料的品种、规格及其主要性能等情况。