简介：Acousticfatiguelifeevaluationisessentialforthermalprotectionstructuresduetotheseverethermo-acousticloadinservice.AstudyontemperaturedependenceofacousticfatiguelifeforaC/SiCpanelispresentedinthispaper.EffectsoftemperatureonboththestructuralresponsesandtheS–Ncurvesareinvestigated.TheDirlikmethodisadoptedtopredictthefatiguelifeofaC/SiCpanelatthreedifferenttemperaturesrespectively.Significantdifferencesareobservedfromtheresultsofnumericalsimulationsbetweenthefatiguelivesofthepanelinthethreecases.Thetemperature-dependenceofacousticfatiguelifeofaC/SiCpanelisverified,andfatiguetestofthematerialneedstobemoreattentivelyperformed.

简介：Fatiguecrackingtestsofasolderjointwerecarriedoutusingin-situscanningelectronmicroscopy(SEM)technologyundertensileandbendingcyclicloadings.Themethodforpredictingthefatiguelifeisprovidedbasedonthefatiguecrackgrowthrateofthesolderjoint.Theresultsshowthattheeffectoftheloadingtypeonthefatiguecrackgrowthbehaviorofasolderjointcannotbeignored.Inaddition,thefiniteelementanalysisresultshelpquantitativelyestimatetheresponserelationshipbetweensolderjointstructures.Thefatiguecrackinitiationlifeofasolderjointisingoodagreementwiththefatiguelife(N50%)ofatotallyelectronicboardwith36solderjoints.