简介：在一台半导体设备构造一根相连的金属线的原子被电子流动在高密度搬运。这现象被称为electromigration，它可以引起线失败。以便描绘electromigration失败，比较研究被执行，一些典型现象为薄、大的结构由破裂力学对待。薄结构的一个例子，被破裂力学对待，是硅石为通讯系统的光纤维。在由electromigration的一根金属线的损坏生长在光纤维使遭到了到静态的疲劳的硅石与裂缝生长比较被描绘。另外，简短比较在大结构在electromigration失败和一些破裂现象之间被做。

简介：Cu和Ni原子经历liquid–solidelectromigration(L-S他们)的散开行为用Cu/Sn/Ni被调查在5.0×103在250°C的2。电子的流动方向显著地影响Cu和Ni原子的跨solder相互作用，即在顺风的散开下面，Cu和Ni原子能扩散到相反的接口；当在迎风的散开，Cuatoms然而并非Ni下面原子能扩散到相反的接口时。当电子从Cu流动到Ni时，仅仅Cu原子扩散到相反的阳极Ni接口，导致从Ni3Sn4进(Cu，Ni)6Sn5并且进进一步[(Cu，Ni)6Sn5+Cu6Sn5],当noNi原子扩散到相反的阴极Cu接口并且这样时界面的Cu6Sn5留下了。从Ni的Whenelectrons流动到Cu，Cu和Ni原子扩散到相反的接口，resultingin从起始的Cu6Sn5进(Cu，Ni)6Sn5并且进进一步[(Cu，Ni)6Sn5+(Ni,Cu)3在阳极Cu接口的Sn4]当时那从起始的Ni3Sn4进(Cu，Ni)6Sn5并且进进一步(Ni，Cu)3在阴极Ni接口的Sn4损坏，电子比另外的方法从Cu流动到Ni是更多的。

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简介：Anenergyapproachisproposedtodescribetheelectromigrationinducedgrainrotationunderhighcurrentdensity.Thedrivingforceisassumedtoarisefromthegrain-boundaryenergyreductionandincreaseoftheinnerenergyfromthejouleheating.Energydissipatesbythegrainboundarydiffusionunderelectromigrationandviscousboundaryslidingisconsidered.Basedontheconservationofenergyproductionanddissipation,anequilibriumequationisdevelopedtopredictthegrainrotationrateanalytically.Itisrecognizedthatthegrainrotateswiththereducingofelectricalresistivityandinverselyproportionaltothegrainlength.Thetheoreticalpredictioniscomparedwiththeexperimentaldata,whichshowsgoodaccuracyontherotationtrendandthespecificrotationrate.

简介：TheCu/Sn-3.OAg-0.5Cu/Cubuttingsolderjointswerefabricatedtoinvestigatetheevolutionoftheinterfacialintermetalliccompound(IMC)andthedegradationofthetensilestrengthofsolderjointsundertheeffectofelectromigration(EM)andagingprocesses.Scanningelectronmicroscopy(SEM)resultsindicatedthattheCu_6Sn_5interfacialIMCpresentedobviousasymmetricalgrowthwiththeincreaseofEMtimeundercurrentdensityof1.78×10~4A/cm~2at100℃,andthegrowthofanodicIMCpresentedaparabolicrelationshipwithtimewhilethecathodicIMCgotthinnergradually.However,asforagingsamplesat100℃withoutcurrentstressing,theCu_6Sn_5IMCpresentedasymmetricalgrowthwithaslowerratethantheanodicIMCofEMsamples.Thetensileresultsindicatedthatthetensilestrengthofthesolderjointsundercurrentstressdeclinedmoredrasticwithtimethantheagingsamples,andthefracturemodetransformedfromductilefracturetobrittlefracturequicklywhilethefracturemodeofagingsamplestransformedfromcup-coneshapedfracturetomicroporousgatheringfractureinaslowway.

简介：以便获得两高电镀物品迁居(他们)在高周波的表面的可靠性和罚款维的控制声学的波浪(锯)设备，4-layeredTi/Al-Mo/Ti/Al-Mo电极电影在128°Y-XLiNbO3上被调查由劈啪作响的底层免职。结果显示4-layered电影与常规Al-0.5wt.%Cu电影相比有改进他们可靠性。他们的一生比在5×的当前的密度测试的Al-0.5wt.%Cu电影的长约三倍107A/厘米2和200°C的温度。而且，4-layered电影容易在反应离子蚀刻被蚀刻，罚款维的控制为高周波的锯设备在模式复制期间被认识到。为4-layered电影，最佳瞬间数量和劈啪作响的参数为高他们可靠性是很重要的。