简介:高分辨率3D非线性的综合倒置方法基于非线性的理论。在层控制下面,从几口井的日志数据(或所有井)在学习区域和地震踪迹,邻近井的数据是到有多重输入和产量的一个网络的输入并且综合地被训练获得全部学习区域的一个适应重量函数。综合非线性的印射关系被水库的侧面、垂直的地质的变化造并且更新。因此,倒置过程和它的倒置结果能被抑制并且控制并且有有速度倒置,阻抗倒置,和密度倒置节的高分辨率的稳定的地震倒置节,能被获得。好地质的效果在模型计算测试并且真实数据处理被获得了,它证实这个方法让高精确,好实物,和罐头被用于量的水库分析。
简介:Inthispaper,a3Dsourcedistributiontechniqueisusedtocalculatethecoupledmotionsbetweentwoshipswhichadvanceinthewavewiththesamespeed.Thenumericalresultsofcoupledmotionsforafrigateandasupplyshiphaveagoodagreementwiththeexperimentalresults.Basedonthe3Dcoupledmotionsoftwoships,aspectralanalysisisemployedtoclearlyobservetheeffectofspeed,clearanceandwaveheadingonthesignificantrelativemotionamplitude(SRMA)oftwoships.Themethodpresentedinthispaperwillbehelpfultoselectsuitableclearance,speedandwaveheadingforunderwayreplenishmentatsea(RAS).
简介:目前,3D打印技术在飞速发展,但3D打印机又重又贵,就连好奇心这么强的东子哥哥我也常常"望机兴叹"。不过,最近有好消息传来,国外设计师设计了方便又小巧的3D涂鸦笔,售价仅仅32美元,它能让3D技术真正走进人们的生活。3D涂鸦笔在"笔尖"整合了3D打印机的"打印端"技术。
简介:Thispaperpresentsanewalgorithmforgenerating3DimagesofB-repsobjectswithtrimmedsurfaceboundaries.The3Dimageisadiscretevoxel-maprepresentationwithinaCubicFrameBuffer(CFB).Thedefinitionof3Dimagesforcurve,surfaceandsolidobjectareintroducedwhichimplytheconnectivityandfidelityrequirements.AdaptiveForwardDifferencingmatrix(AFD-matrix)for1D-3Dmanifoldsin3Dspaceisdeveloped.BysettingrulestoupdatetheAFD-matrix,theforwarddifferencedirectionandstepwisecanbeadjusted.Finally,anefficientalgorithmispresentedbasedontheAFD-matrixconceptforconvertingtheobjectin3Dspaceto3Dimagein3Ddiscretespace.
简介:Thetraditionalstrategyof3Dmodelreconstructionmainlyconcentratesonorthographicprojectionsorengineeringdrawings.Buttherearesomeshortcomings.Suchas,onlyfewkindsofsolidscanbereconstructed,thehighcomplexityoftimeandlessinformationaboutthe3Dmodel.Theresearchisextendedandprocesscardistreatedaspartofthe3Dreconstruction.Asetofprocessdataisasupersetof2Dengineeringdrawingsset.Thesetcomprisesprocessdrawingsandprocesssteps,andshowsasequencingandasymptoticcoursethatapartismadefromroughcastblanktofinalproduct.Accordingtothesecharacteristics,theobjecttobereconstructedistranslatedfromthecomplicatedengineeringdrawingsintoaseriesofmuchsimplerprocessdrawings.Withtheplentifulprocessinformationaddedforreconstruction,thedisturbancessuchasirrelevantgraph,symbolandlabel,etc.canbeavoided.Andmore,theformchangeofbothneighborprocessdrawingsissolittlethattheengineeringdrawingsinterpretationhasnodifficulty;inaddition,theabnormalsolutionandmulti-solutioncanbeavoidedduringreconstruction,andtheproblemsofbeingapplicabletomoreobjectsissolvedultimately.Therefore,theutilitymethodfor3Dreconstructionmodelwillbepossible.Ontheotherhand,thefeatureinformationinprocesscardsisprovidedforreconstructionmodel.Focusingonprocesscards,thefeasibilityandrequirementsofWorkingProcedureModelreconstructionisanalyzed,andthemethodtoapplyandimplementtheNaturalLanguageUnderstandingintothe3Dreconstructionisstudied.Themethodofasymptoticapproximationproductwasproposed,bywhicha3Dprocessmodelcanbeconstructedautomaticallyandintelligently.Theprocessmodelnotonlyincludestheinformationaboutpartscharacters,butalsocandelivertheinformationofdesign,processandengineeringtothedownstreamapplications.
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简介:Seismicdataacquiredinseabeachwasaffectedbylargevariationsinnear-surfacemedia,seriousreceiverdrifting,serioushigh-frequencynoises,heavymultiples,complexsubsurfacegeologyanddifficultiesinimaging.BGPResearchInstitute,havingworkedonthecorrespondingissuesforseveralyears,hascompletedaseriesofcomplexseabeach3Dseismicinterpretationapproachesincludingsyntheticseismiccalibrationwithdirectionalwelldata,analysisofstressfield,correlatinginterpretationwithmulti-screenmulti-linerecursion,
简介:3Dprintingisdisruptingthedesignandmanufactureofelectronicproducts.3Dprintingelectronicsoffersgreatpotentialtobuildcomplexobjectwithmultiplefunctionalities.Particularly,ithasshowntheuniqueabilitytomakeembeddedelectronics,3Dstructuralelectronics,conformalelectronics,stretchableelectronics,etc.3Dprintingelectronicshasbeenconsideredasthenextfrontierinadditivemanufacturingandprintedelectronics.Overthepastfiveyears,alargenumberofstudiesandeffortsregarding3Dprintingelectronicshavebeencarriedoutbybothacademiaandindustries.Inthispaper,acomprehensivereviewofrecentadvancesandsignificantachievementsin3Dprintingelectronicsisprovided.Furthermore,theprospects,challengesandtrendsof3Dprintingelectronicsarediscussed.Finally,somepromisingsolutionsforproducingelectronicswith3Dprintingarepresented.